XYCOM 138605-098 Detailed Introduction

XYCOM 138605-098 is a high-performance industrial grade motherboard designed specifically for demanding server, data center, and industrial automation scenarios. The motherboard adopts advanced manufacturing technology and strict quality control standards, supports multi platform expansion and long-term stable operation, and is suitable for cloud computing, edge computing, industrial control and other high reliability demand fields.

Main features and advantages

High compatibility processor support: compatible with Intel Xeon Scalable series and AMD EPYC processors, providing flexible computing performance configurations.

Scalability design: equipped with 4 PCIe 4.0 slots and M.2 NVMe interface, supporting high-speed storage and AI acceleration card expansion.

Redundant power supply scheme: Dual 12V redundant power input, combined with intelligent power management module, ensures uninterrupted operation 24/7.

Industrial grade heat dissipation architecture: adopting multi fan heat dissipation and optimized design with thermal conductive silicone grease, suitable for extreme temperature environments ranging from -20 ° C to 60 ° C.

Anti interference capability: Through EMI/ESD certification, it has anti electromagnetic interference and electrostatic protection functions, suitable for high interference industrial scenarios.

technical specifications

Category parameters

The processor supports Intel Xeon Scalable (LGA 4189) and AMD EPYC (SP3)

Memory with 8 DDR4 DIMM slots, supporting up to 256GB (single 32GB)

4 SATA III storage interfaces, 2 M.2 NVMe (PCIe 4.0), 2 U.2 interfaces

Expansion slots 4 x PCIe 4.0 (x16), 1 x PCIe 3.0 (x1)

Network controller with dual Intel I210-AT Gigabit Ethernet cards, supporting redundant network configurations

Power input dual 12V redundant power supply (maximum power 500W)

Working temperature -20 ° C to 60 ° C

application area

XYCOM 138605-098 is mainly used in the following scenarios

Cloud computing and data centers: support virtualization cluster deployment to meet high-density computing and storage requirements.

Industrial automation: compatible with PLC, robot control and other equipment, providing stable data processing capabilities.

Edge computing node: applicable to remote monitoring, IoT gateway and other scenarios requiring low latency response.