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Popular Product

Honeywell 51307190-150 EHPM I/O Link Module


Manufacturer: Honeywell

Product Number: 51307190-150

Category: EHPM I/O Link Module / Communication Interface

Function: I/O link communication for Honeywell systems

Application: I/O communication, device integration

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Product Description

The Honeywell 51307190-150 is an Enhanced High-Performance Process Manager (EHPM) I/O Link Module. It facilitates seamless communication between the EHPM and Input/Output Processors (IOPs) in industrial automation systems. By providing an efficient data exchange, it enhances control system performance, making it ideal for various industrial applications.

Technical Specifications

  • Product Type: EHPM I/O Link Module

  • Manufacturer: Honeywell

  • Model Number: 51307190-150

  • Operating Temperature: -10°C to +55°C

  • Storage Temperature: -40°C to +70°C

  • Dimensions: 2.2 cm x 12.4 cm x 12.6 cm

  • Weight: 0.1 kg

Functionality

  • Provides communication via the I/O Link interface

  • Includes SRAM for processor communication

  • Features I/O Link driver/receiver interface for optimized data exchange

Application Areas

Popular Product

Honeywell 51307190-150 EHPM I/O Link Module

Manufacturer: Honeywell

Product Number: 51307190-150

Category: EHPM I/O Link Module / Communication Interface

Function: I/O link communication for Honeywell systems

Application: I/O communication, device integration

Contact Sales

Product Description

The Honeywell 51307190-150 is an Enhanced High-Performance Process Manager (EHPM) I/O Link Module. It facilitates seamless communication between the EHPM and Input/Output Processors (IOPs) in industrial automation systems. By providing an efficient data exchange, it enhances control system performance, making it ideal for various industrial applications.

Technical Specifications

  • Product Type: EHPM I/O Link Module

  • Manufacturer: Honeywell

  • Model Number: 51307190-150

  • Operating Temperature: -10°C to +55°C

  • Storage Temperature: -40°C to +70°C

  • Dimensions: 2.2 cm x 12.4 cm x 12.6 cm

  • Weight: 0.1 kg

Functionality

  • Provides communication via the I/O Link interface

  • Includes SRAM for processor communication

  • Features I/O Link driver/receiver interface for optimized data exchange

Application Areas

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