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GE Fanuc IC670CHS001 Chassis Module
Manufacturer:GE Fanuc
Product Number:IC670CHS001
Product Type:Chassis / Backplane Base
Origin:USA
Dimensions:100 mm × 160 mm × 120 mm
Weight:0.85 kg
Views:121
Payment Methods:T/T, PayPal, Western Union
Condition:New & In Stock
Warranty:1 Year
Lead Time:1-3 Working Days
Certificate:COO
Courier partners:DHL, UPS, TNT, FedEx and EMS.
Business hours:7*24
Product Description
The GE IC670CHS001 is a 3-slot chassis module designed for the RX3i / IC670 PLC platform. From an engineering perspective, this chassis provides a reliable backplane for housing a combination of CPU, I/O, and communication modules in a compact footprint. Its modular design allows easy integration into small to mid-sized control systems while maintaining consistent bus timing, signal integrity, and power distribution.
The IC670CHS001 is a preferred choice for engineers who require a compact, serviceable platform capable of supporting expansion without compromising system stability.
Technical Specifications
| Parameter | Description |
|---|---|
| Model Number | IC670CHS001 |
| Brand | GE / Fanuc |
| Module Type | Chassis / Backplane Base |
| Platform Compatibility | RX3i / IC670 Series PLC |
| Number of Slots | 3 |
| Bus Architecture | Proprietary IC670 backplane bus |
| Power Distribution | Integrated bus for 5 VDC, 24 VDC signaling |
| Communication | Backplane bus communication between modules |
| Mounting | Panel or rack-mountable |
| Operating Temperature | 0°C to +60°C |
| Storage Temperature | –40°C to +85°C |
| Dimensions (H × W × D) | ≈ 100 mm × 160 mm × 120 mm |
| Weight | ≈ 0.85 kg |
| Material | Industrial-grade steel with PCB backplane |
Applications / Use Scenarios
-
Hosting CPUs, communication modules, and I/O cards in RX3i / IC670 systems
-
Small to medium machine-level control systems
-
OEM machinery control where compact, modular backplanes are required
-
Retrofit projects where a 3-slot chassis meets system expansion needs
-
Laboratory and pilot plant control benches
Advantages / Engineering Benefits
-
Compact 3-slot footprint allows integration into small panels
-
Reliable backplane connections maintain signal integrity across modules
-
Ease of maintenance, modules can be inserted or removed without special tools
-
Industrial-grade construction ensures vibration resistance and durability
-
Standardized bus architecture allows cross-compatibility within IC670 family
-
Lightweight yet robust design simplifies field installation
FAQs
-
How many slots does IC670CHS001 provide?
– Three slots for CPU, I/O, or communication modules.
-
Which modules are compatible?
– RX3i / IC670 series modules including CPUs, analog/digital I/O, and communication cards.
-
Is the chassis rack-mountable?
– Yes, it can be mounted in standard industrial panels.
-
Does it provide integrated power distribution?
– Yes, both 5 VDC and 24 VDC buses are included.
-
Can modules be hot-swapped?
– No, power should be removed before module insertion/removal.
-
What is the operating temperature range?
– 0°C to +60°C.
-
Is the backplane bus proprietary?
– Yes, specifically designed for IC670/RX3i modules.
-
What is the typical weight?
– Approximately 0.85 kg.
-
Is the chassis suitable for vibration-heavy environments?
– Yes, industrial-grade construction ensures reliability.
-
Can multiple chassis be linked together?
– Yes, through appropriate bus expansion and communication modules.
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GE Fanuc IC670CHS001 Chassis Module
Manufacturer:GE Fanuc
Product Number:IC670CHS001
Product Type:Chassis / Backplane Base
Origin:USA
Dimensions:100 mm × 160 mm × 120 mm
Weight:0.85 kg
Views:121
Payment Methods:T/T, PayPal, Western Union
Condition:New & In Stock
Warranty:1 Year
Lead Time:1-3 Working Days
Certificate:COO
Courier partners:DHL, UPS, TNT, FedEx and EMS.
Business hours:7*24
Product Description
The GE IC670CHS001 is a 3-slot chassis module designed for the RX3i / IC670 PLC platform. From an engineering perspective, this chassis provides a reliable backplane for housing a combination of CPU, I/O, and communication modules in a compact footprint. Its modular design allows easy integration into small to mid-sized control systems while maintaining consistent bus timing, signal integrity, and power distribution.
The IC670CHS001 is a preferred choice for engineers who require a compact, serviceable platform capable of supporting expansion without compromising system stability.
Technical Specifications
| Parameter | Description |
|---|---|
| Model Number | IC670CHS001 |
| Brand | GE / Fanuc |
| Module Type | Chassis / Backplane Base |
| Platform Compatibility | RX3i / IC670 Series PLC |
| Number of Slots | 3 |
| Bus Architecture | Proprietary IC670 backplane bus |
| Power Distribution | Integrated bus for 5 VDC, 24 VDC signaling |
| Communication | Backplane bus communication between modules |
| Mounting | Panel or rack-mountable |
| Operating Temperature | 0°C to +60°C |
| Storage Temperature | –40°C to +85°C |
| Dimensions (H × W × D) | ≈ 100 mm × 160 mm × 120 mm |
| Weight | ≈ 0.85 kg |
| Material | Industrial-grade steel with PCB backplane |
Applications / Use Scenarios
-
Hosting CPUs, communication modules, and I/O cards in RX3i / IC670 systems
-
Small to medium machine-level control systems
-
OEM machinery control where compact, modular backplanes are required
-
Retrofit projects where a 3-slot chassis meets system expansion needs
-
Laboratory and pilot plant control benches
Advantages / Engineering Benefits
-
Compact 3-slot footprint allows integration into small panels
-
Reliable backplane connections maintain signal integrity across modules
-
Ease of maintenance, modules can be inserted or removed without special tools
-
Industrial-grade construction ensures vibration resistance and durability
-
Standardized bus architecture allows cross-compatibility within IC670 family
-
Lightweight yet robust design simplifies field installation
FAQs
-
How many slots does IC670CHS001 provide?
– Three slots for CPU, I/O, or communication modules.
-
Which modules are compatible?
– RX3i / IC670 series modules including CPUs, analog/digital I/O, and communication cards.
-
Is the chassis rack-mountable?
– Yes, it can be mounted in standard industrial panels.
-
Does it provide integrated power distribution?
– Yes, both 5 VDC and 24 VDC buses are included.
-
Can modules be hot-swapped?
– No, power should be removed before module insertion/removal.
-
What is the operating temperature range?
– 0°C to +60°C.
-
Is the backplane bus proprietary?
– Yes, specifically designed for IC670/RX3i modules.
-
What is the typical weight?
– Approximately 0.85 kg.
-
Is the chassis suitable for vibration-heavy environments?
– Yes, industrial-grade construction ensures reliability.
-
Can multiple chassis be linked together?
– Yes, through appropriate bus expansion and communication modules.
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