The ABB DSBB172B (3BSE014017R1) backplane is an essential component designed for use with ABB’s modular I/O systems. This robust backplane offers reliable communication between the system’s control units and field devices, providing an interface for connecting and powering various I/O modules within the ABB industrial automation framework. It forms the backbone of automation systems, ensuring smooth data transmission and reliable operation.

Constructed for high-performance applications, the DSBB172B backplane is engineered to meet the demanding conditions of industrial environments. Its compact design and durable materials make it suitable for installation in control cabinets, offering ease of integration with ABB’s AC 800M and S800 I/O systems.

Product Parameters

Product Applications

The DSBB172B backplane is ideal for use in a variety of automation systems, including:

• Power Generation: Provides the core interface for communication and control within thermal, hydroelectric, and renewable power plants.

• Oil & Gas: Used for reliable I/O connections in upstream and downstream operations, ensuring high availability and efficiency.

• Chemical Manufacturing: Supports modular I/O configurations for continuous process monitoring and control in chemical production.

• Water and Wastewater Treatment: Facilitates smooth communication between sensors, controllers, and field devices in water treatment plants.

• Industrial Automation: Used in manufacturing environments where precise control, monitoring, and data collection are critical, such as automotive or electronics assembly lines.

• Pharmaceutical and Food Production: Ensures compliance and operational precision in regulated environments, offering seamless data exchange between I/O and control systems.

Product Advantages

• Reliable Communication: Ensures stable data transmission and system reliability, critical for high-performance automation systems.

• Modular and Scalable: Can be easily integrated with ABB’s I/O modules, allowing flexibility and scalability in system design.

• Compact and Space-Saving: Designed to fit into standard DIN rail mountings, optimizing space in control cabinets.

• Easy Installation: Quick and straightforward to install with plug-and-play functionality, minimizing system downtime during integration.

• Industrial-Grade Durability: Built to endure harsh environmental conditions, including wide temperature ranges and high humidity levels.

• Powerful Integration: Perfectly integrates with ABB’s industrial automation solutions, providing smooth system expansion and future-proofing.

Frequently Asked Questions (FAQ)

Q1: What is the purpose of the DSBB172B backplane?

A1: The DSBB172B is used to interconnect I/O modules with the control system, facilitating communication and power distribution.

Q2: Is the DSBB172B compatible with both AC 800M and S800 I/O systems?

A2: Yes, it is designed to work seamlessly with both ABB’s AC 800M and S800 I/O systems.

Q3: What are the dimensions and weight of the DSBB172B backplane?

A3: The backplane measures 163 x 60 x 20 mm and weighs 0.555 kg.

Q4: How is the DSBB172B mounted?

A4: It is mounted on a DIN rail, allowing easy installation in standard control cabinets.

Q5: What power supply does the DSBB172B require?

A5: It requires a 24 V DC power supply for operation.

Q6: Can the DSBB172B be used in environments with high humidity?

A6: Yes, it is designed to function in environments with humidity levels ranging from 5% to 95% non-condensing.

Q7: What certifications does the DSBB172B have?

A7: The DSBB172B is CE, UL, and RoHS compliant.

Q8: What types of modules can be connected to the DSBB172B backplane?

A8: It supports a wide range of I/O modules, including digital, analog, and specialty modules within the ABB S800 I/O system.

Q9: What is the operating temperature range for the DSBB172B?

A9: It operates in the temperature range of -25°C to +70°C.

Q10: Can I use the DSBB172B for applications outside industrial control systems?

A10: The DSBB172B is primarily designed for industrial automation systems, but it can be used in any application requiring robust, modular communication between components.