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GE Fanuc IC670GBI002 General Bus Interface Module
Manufacturer:GE Fanuc
Product Number:IC670GBI002
Product Type:General Bus Interface Module
Origin:USA
Dimensions:110 mm × 35 mm × 120 mm
Weight:0.48 kg
Views:143
Payment Methods:T/T, PayPal, Western Union
Condition:New & In Stock
Warranty:1 Year
Lead Time:1-3 Working Days
Certificate:COO
Courier partners:DHL, UPS, TNT, FedEx and EMS.
Business hours:7*24
Product Description
The GE IC670GBI002 is a General Bus Interface (GBI) module designed for the IC670 / RX3i PLC platform. Its primary function is to provide a robust communication bridge between the backplane bus of the IC670 chassis and remote or auxiliary I/O networks.
From a system integration perspective, the GBI module ensures deterministic data transfer between central CPUs and distributed I/O modules, supporting scalable industrial automation networks. It is widely used in applications where multiple chassis or extended I/O systems are deployed and centralized control must maintain low latency and high reliability.
Technical Specifications
| Parameter | Description |
|---|---|
| Model Number | IC670GBI002 |
| Brand | GE / Fanuc |
| Module Type | General Bus Interface (GBI) |
| Platform Compatibility | IC670 / RX3i Series PLC |
| Function | Backplane-to-remote I/O communication |
| Bus Protocol | IC670 proprietary backplane |
| Communication Ports | RS-232 / RS-485 serial connections |
| Addressing | DIP switch configurable |
| Power Supply | Rack-powered (5 VDC logic, 24 VDC optional field supply) |
| Operating Temperature | 0°C to +60°C |
| Storage Temperature | –40°C to +85°C |
| Dimensions (H × W × D) | ≈ 110 mm × 35 mm × 120 mm |
| Weight | ≈ 0.48 kg |
| Mounting | IC670-compatible chassis slot or DIN-rail with adapter |
Applications / Use Scenarios
-
Connecting multiple IC670 chassis within a distributed control network
-
Serving as communication bridge between central CPU and remote I/O racks
-
Scalable factory automation systems with modular IC670 expansion
-
Retrofitting older RX3i systems to support additional remote I/O
-
Ensuring deterministic, low-latency communication for high-speed process control
Advantages / Engineering Benefits
-
Deterministic communication ensures timely data transfer across multiple racks
-
Supports both RS-232 and RS-485 for flexible serial network topologies
-
DIP switch configuration simplifies addressing and system setup
-
Compact design fits IC670 standard backplane slots without additional hardware
-
Industrial-grade construction enhances reliability in harsh environments
-
Facilitates modular system expansion without redesigning core CPU programs
FAQs
-
What is the primary function of IC670GBI002?
– Provides a communication bridge between backplane and remote I/O modules.
-
Which PLC chassis is it compatible with?
– IC670 / RX3i series 3-slot and larger chassis.
-
What serial protocols does it support?
– RS-232 and RS-485.
-
How is addressing configured?
– Through DIP switches on the module.
-
Is power supplied through the chassis?
– Yes, standard rack-powered 5 VDC logic, with 24 VDC optional for field devices.
-
What is the maximum operating temperature?
– 60°C.
-
Can multiple GBI modules be used in one network?
– Yes, supports multi-rack distributed I/O configurations.
-
Is hot-swapping supported?
– No, power should be removed before insertion or removal.
-
What is the typical weight?
– Approximately 0.48 kg.
-
Is it suitable for industrial vibration-prone environments?
– Yes, designed with rugged construction for reliability.
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GE Fanuc IC670GBI002 General Bus Interface Module
Manufacturer:GE Fanuc
Product Number:IC670GBI002
Product Type:General Bus Interface Module
Origin:USA
Dimensions:110 mm × 35 mm × 120 mm
Weight:0.48 kg
Views:143
Payment Methods:T/T, PayPal, Western Union
Condition:New & In Stock
Warranty:1 Year
Lead Time:1-3 Working Days
Certificate:COO
Courier partners:DHL, UPS, TNT, FedEx and EMS.
Business hours:7*24
Product Description
The GE IC670GBI002 is a General Bus Interface (GBI) module designed for the IC670 / RX3i PLC platform. Its primary function is to provide a robust communication bridge between the backplane bus of the IC670 chassis and remote or auxiliary I/O networks.
From a system integration perspective, the GBI module ensures deterministic data transfer between central CPUs and distributed I/O modules, supporting scalable industrial automation networks. It is widely used in applications where multiple chassis or extended I/O systems are deployed and centralized control must maintain low latency and high reliability.
Technical Specifications
| Parameter | Description |
|---|---|
| Model Number | IC670GBI002 |
| Brand | GE / Fanuc |
| Module Type | General Bus Interface (GBI) |
| Platform Compatibility | IC670 / RX3i Series PLC |
| Function | Backplane-to-remote I/O communication |
| Bus Protocol | IC670 proprietary backplane |
| Communication Ports | RS-232 / RS-485 serial connections |
| Addressing | DIP switch configurable |
| Power Supply | Rack-powered (5 VDC logic, 24 VDC optional field supply) |
| Operating Temperature | 0°C to +60°C |
| Storage Temperature | –40°C to +85°C |
| Dimensions (H × W × D) | ≈ 110 mm × 35 mm × 120 mm |
| Weight | ≈ 0.48 kg |
| Mounting | IC670-compatible chassis slot or DIN-rail with adapter |
Applications / Use Scenarios
-
Connecting multiple IC670 chassis within a distributed control network
-
Serving as communication bridge between central CPU and remote I/O racks
-
Scalable factory automation systems with modular IC670 expansion
-
Retrofitting older RX3i systems to support additional remote I/O
-
Ensuring deterministic, low-latency communication for high-speed process control
Advantages / Engineering Benefits
-
Deterministic communication ensures timely data transfer across multiple racks
-
Supports both RS-232 and RS-485 for flexible serial network topologies
-
DIP switch configuration simplifies addressing and system setup
-
Compact design fits IC670 standard backplane slots without additional hardware
-
Industrial-grade construction enhances reliability in harsh environments
-
Facilitates modular system expansion without redesigning core CPU programs
FAQs
-
What is the primary function of IC670GBI002?
– Provides a communication bridge between backplane and remote I/O modules.
-
Which PLC chassis is it compatible with?
– IC670 / RX3i series 3-slot and larger chassis.
-
What serial protocols does it support?
– RS-232 and RS-485.
-
How is addressing configured?
– Through DIP switches on the module.
-
Is power supplied through the chassis?
– Yes, standard rack-powered 5 VDC logic, with 24 VDC optional for field devices.
-
What is the maximum operating temperature?
– 60°C.
-
Can multiple GBI modules be used in one network?
– Yes, supports multi-rack distributed I/O configurations.
-
Is hot-swapping supported?
– No, power should be removed before insertion or removal.
-
What is the typical weight?
– Approximately 0.48 kg.
-
Is it suitable for industrial vibration-prone environments?
– Yes, designed with rugged construction for reliability.
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